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How to access this journal electronically To benefit from electronic access to this journal you first need to register via the Internet. Your access includes a variety of features that increase the value of your journal subscription. See page following contents for full details of what your access includes.Īs a subscriber to this journal, you can benefit from instant, electronic access to this title via Emerald Fulltext. You can also search over 100 additional Emerald journals in Emerald Fulltext: FengerĤ6 Reliability testing and data analysis of lead-free solder joints for high-density packages John Lau, Nick Hoo, Rob Horsley, Joe Smetana, Dongkai Shangguan, Walter Dauksher, Dave Love, Irv Menis and Bob Sullivanĩ3 Association news 97 New products 103 Industry news 109 Exhibitions and conferences 112 Appointments 112 International diaryĪccess this journal electronically The current and past volumes of this journal are available at: BaiĤ1 CBGA solder joint thermal fatigue life estimation by a simple method T.E. HuangĨ8 Internet commentary 91 Book reviews 93 Company profileĢ7 Strategies for improving the reliability of solder joints on power semiconductor devices Guo-Quan Lu, Xingsheng Liu, Sihua Wen, Jesus Noel Calata and John G. PlumbridgeĢ1 Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate Eric C.C. Thompsonġ3 Long term mechanical reliability with lead-free solders W.J. Evans, Ping Seto, Tarun Gupta and James R. Nokibul Islam, Tushar Shete, Pradeep Lall, Michael J. John Lau, Dongkai Shangguan, Todd Castello, Rob Horsley, Joe Smetana, Nick Hoo, Walter Dauksher, Dave Love, Irv Menis and Bob Sullivanĥ French abstracts 7 German abstracts 9 Editorial 10 Contributorsħ7 Thermal cycling reliability of lead-free chip resistor solder joints Jeffrey C. Ricky LeeĦ9 Failure analysis of lead-free solder joints for high-density packages Soldering & Surface Mount Technology Volume 16 NumSolder joint reliability Guest Editor: Professor S.W.
Soldering & Surface Mount Technology Solder joint reliability Guest Editor: Professor S.W.